On December 13, Daquan Group and Xi'an Jiaotong University held a signing ceremony of the cooperation of Advanced Electrical Technology Research Institute in Daquan Nanjing Research Institute. Wang Tiejun, vice president of Xi'an Jiaotong University and Ge Fei, the executive president of Daquan Group, signed the contract. Xu Xiang, president of Daquan Group, Pei Jun, general manager of Daquan Group Technology Center, and more than ten professors such as Rongshizhe, vice chancellor of Xi'an Jiaotong University participated in the signing ceremony .
A heat sink is a device that incorporates a fan or another mechanism to reduce the temperature of a hardware component (e.g., processor). There are two heat sink types: active and passive. The picture is an example of a heat sink with both active and passive cooling mechanisms.
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Besides of Metal Stamping Components,the Amplifiers metel chassises and Panels, we also complete solution for OEM/ODM Products & components, offer services of deep drawing services, EMI metal shielding parts, heat sink ,plastic molding products for custom, PVC fittings ,pvc conduit fittings, Plastic Injection Components, Metal Stamping Parts, home appliances accessories ,R/C drone and smart electronic toys etc.
Product description:
The material used partly determines the extent of thermal conductivity. Copper and aluminum are the most widely used materials, though aluminum is the more common choice because copper is more expensive and heavier. Aluminum 6061 and 6063 are widely used with a thermal resistance of 166 and 201 W / mK, respectively.
Mosfet Heatsink,Aluminum Alloy Mosfet Heatsink,1000W Mosfet Heatsink,High Voltage Mosfet
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