A major breakthrough! SMIC successfully mass-produced 28nm Qualcomm Snapdragon 410

Today, SMIC, the largest foundry and most technologically advanced integrated circuit foundry in mainland China, today announced the successful adoption of Qualcomm Snapdragon 410 processor in its 28nm process for mainstream smartphones, which is the core of 28nm Chip an important step towards commercial applications, opening up a new era of advanced mobile phone chips landing China.

This is another significant breakthrough made by SMIC in the 28nm process cooperation after the successful announcement of Qualcomm processors announced at the end of last year.

Qualcomm Snapdragon 410 integrated 4G LTE connectivity, mass-market smartphone offers a wealth of features, compared with the 40-nanometer process, the processor logic density of 28 nanometer manufacturing process to double the speed by 20% to 30%, reducing power consumption 30% to 50%.

Dr. Chiu Tsz Wan, CEO and Executive Director of SMIC, said: "The first batch of products manufactured using SMIC's 28-nanometer manufacturing process performed well and we received the recognition from Qualcomm and the terminal handset manufacturers, which is equally significant to the entire industry chain In close cooperation with Qualcomm, we achieved a breakthrough in manufacturing core chips for mainstream smartphones in mainland China and created a new era for the production of 28-nanometer advanced process mobile chips in China In the future, with the development of 28-nanometer process, we expect Qualcomm and other global customers to provide more advanced technology and more extensive technical support. "

Derek Abboli, Qualcomm's president, said: "The Snapdragon 410 processor from SMIC's 28nm process is a leading chipset designed for the latest generation of smartphones and tablets in the mass market and is used in mainstream smartphones The realization of commercialization marks another significant progress made by Qualcomm and SMIC in the cooperation of advanced process manufacturing and wafer manufacturing. "

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